Mechanical Debonding for Flexible Display Production

초록

The mass production of flexible display currently relies on laser-based liftoff (LLO) process, where bonding between the carrier glass and flexible polyimide (PI) substrate is removed by laser. However, LLO process accompanies degradation at the bottom surface of the PI substrate and is sensitive to particulates. Here, we report a 2D material-based debonding layer for non-laser-based mechanical liftoff process. We demonstrate that debonding force can be lowered from 17.69 gf/in (PI – carrier glass) to 1.50 gf/in (PI – the debonding layer – carrier glass), which surpasses the 5 gf/in industry target for practical liftoff process. This 91.5 % decrease in debonding force is realized by (i) weak bonding forces of PI – debonding layer and debonding layer – carrier glass pairs, along with (ii) the 100 % coating coverage of the debonding layer preventing the direct bonding of the PI – carrier glass pair. This novel liftoff technology can be a competent low-cost and non-damaging solution for flexible display production. © 2022 ITE and SID.

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