반도체 공급사슬에서 주문침투점 선정에 관한 연구

초록

The semiconductor industry has faced a critical need to reduce inventory costs as well as to improve customer service. The literature suggested leagile (both lean and agile) or hybrid push-pull strategies for achieving both goals by positioning decoupling points (customer order penetration points or push-pull boundaries). Although numerous articles have been published on the semiconductor manufacturing, most of them focused on the wafer fab, not on the entire supply chain. Even a single semiconductor company and a semiconductor supply chain have multiple choices for decoupling points depending on the different characteristics of products, processes, and organizational forms. However, the existing literature did not consider those varieties. This paper discovers various decoupling points along the semiconductor supply chain by providing several product-process matrices based on the different characteristics of products, processes, and organizational forms, which gives different findings from the existing literature. It additionally provides an enhanced decision-making approach for the positioning of decoupling points with the tradeoff between customer service and inventory reduction.

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