Recombination of Copper Tiles connected with Chip Resistors for Wide-Angle Metasurface Absorber

초록

In this paper, a design strategy for a wide-angle metasurface absorber is proposed that evolves a configuration for broadband absorption that consists of four 100 Ω chip resistors and a combination of square copper tiles. To satisfy -10 dB reflectance at all incident angles up to 60° for both transverse electric (TE) and transverse magnetic (TM) polarizations, the copper tiles were recombined. To this end, a transformative genetic algorithm was applied, of which the figure of merit was converted from the original one by multiplying a scaling factor with the worst reflectance in the target band. The simulation results confirmed a -10 dB reflectance ranging from 10.8 to 11.21 GHz, with the fractional bandwidth being 3.73% for both TE and TM polarizations at incident angles ranging from 0° to 60°. The accuracy of the proposed design was verified by conducting measurements, which matched well with the simulated results. This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited. © Copyright The Korean Institute of Electromagnetic Engineering and Science.

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