Multi-step ART1 algorithm for recognition of defect patterns on semiconductor wafers

Citations

WEB OF SCIENCE

34
Citations

SCOPUS

38

초록

The integrated circuits (ICs) on wafers are highly vulnerable to defects generated during the semiconductor manufacturing process. The spatial patterns of locally clustered defects are likely to contain information related to the defect generating mechanism. For the purpose of yield management, we propose a multi-step adaptive resonance theory (ART1) algorithm in order to accurately recognise the defect patterns scattered over a wafer. The proposed algorithm consists of a new similarity measure, based on the p-norm ratio and run-length encoding technique and pre-processing procedure: the variable resolution array and zooming strategy. The performance of the algorithm is evaluated based on the statistical models for four types of simulated defect patterns, each of which typically occurs during fabrication of ICs: random patterns by a spatial homogeneous Poisson process, ellipsoid patterns by a multivariate normal, curvilinear patterns by a principal curve, and ring patterns by a spherical shell. Computational testing results show that the proposed algorithm provides high accuracy and robustness in detecting IC defects, regardless of the types of defect patterns residing on the wafer.

키워드

spatial defectsneural networkpattern recognitionsimilaritywafer mapyield managementNEURAL-NETWORK APPROACHSPATIAL-PATTERNBIN MAPYIELDCLASSIFICATIONFABRICATION
제목
Multi-step ART1 algorithm for recognition of defect patterns on semiconductor wafers
저자
Choi, GyunghyunKim, Sung-HeeHa, ChunghunBae, Suk Joo
DOI
10.1080/00207543.2011.574502
발행일
2012
유형
Article
저널명
International Journal of Production Research
50
12
페이지
3274 ~ 3287