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Effects of organic additives on residual stress and surface roughness of electroplated copper for flexible PCB
Effects of organic additives on residual stress and surface roughness of electroplated copper for flexible PCB
- Jongsoo Kim;
- Heesan Kim
키워드
flexible printed circuit board; electroplating; copper; additive; residual stress; surface roughness†Corresponding author: heesankim@yahoo.co.kr1. IntroductionIn general; FPCB (Flexible Printed circuit Board) consists of a polyimide film as an insul; flexible printed circuit board; electroplating; copper; additive; residual stress; surface roughness†Corresponding author: heesankim@yahoo.co.kr1. IntroductionIn general; FPCB (Flexible Printed circuit Board) consists of a polyimide film as an insul
- 제목
- Effects of organic additives on residual stress and surface roughness of electroplated copper for flexible PCB
- 제목 (타언어)
- Effects of organic additives on residual stress and surface roughness of electroplated copper for flexible PCB
- 저자
- Jongsoo Kim; Heesan Kim
- 발행일
- 2007
- 권
- 6
- 호
- 4
- 페이지
- 154 ~ 158
- 출판사
- 한국부식방식학회
- 발행국가
- 대한민국
- 분량
- 5 페이지
- ISSN
- E 2288-6524
P 1598-6462